Package Development, Signal Integrity and Power Integrity Engineer, Staff
Marvell Technology
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Austin, TX
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Associate
Posted April 17, 2026
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Responsibilities
Commitments
Responsibilities
- The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.
- The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements.
- The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
- Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.
- The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.
- The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements.
- The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
Commitments
The expected base pay range for this role may be modified based on market conditions.
Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR).
As such, applicants must be eligible to access export-controlled information as defined under applicable law.
Marvell may be required to obtain export licensing approval from the U.S.
Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C.
1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
Not Met Priorities
What still needs stronger evidence
Requirements
- Strong fundamentals in EM, transmission lines and microwave theory
- Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
- Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
- Familiarity with IC package layout tools like APD or PADS
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
- Working knowledge of circuit design tools: Spectre, ADS, HSpice
- Experience with VNA and TDR measurements for package and PCB characterization
- Frequency domain and time domain knowledge of high speed signaling
- Experience with high-speed electronic packaging for digital and analog ICs
- Power plane design, modeling and analysis using tools like PowerSI, SIwave
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
- Understanding, debugging and simulations of EMI/EMC problems
- This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR).
- Marvell may be required to obtain export licensing approval from the U.S.
Preferred Skills
- Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
- Experience with 2.5D/3D package development is highly desired.
- Experience with VNA and TDR measurements for package and PCB characterization
- Frequency domain and time domain knowledge of high speed signaling
- Experience with high-speed electronic packaging for digital and analog ICs
- Power plane design, modeling and analysis using tools like PowerSI, SIwave
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
- Understanding, debugging and simulations of EMI/EMC problems
- Track record of new product introduction from concept, through development and production is a plus.
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
- Experience with channel simulations using MATLAB or ADS or other tools is a plus.
Education
- (Not required) – Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
What You Can Expect
Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
What We're Looking For
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
Strong fundamentals in EM, transmission lines and microwave theory
Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
Familiarity with IC package layout tools like APD or PADS
Experience with 2.5D/3D package development is highly desired.
Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
Working knowledge of circuit design tools: Spectre, ADS, HSpice
Experience with VNA and TDR measurements for package and PCB characterization
Frequency domain and time domain knowledge of high speed signaling
Experience with high-speed electronic packaging for digital and analog ICs
Power plane design, modeling and analysis using tools like PowerSI, SIwave
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Understanding, debugging and simulations of EMI/EMC problems
Track record of new product introduction from concept, through development and production is a plus.
Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
Experience with channel simulations using MATLAB or ADS or other tools is a plus.
A team player
Expected Base Pay Range (USD)
0 - 0, $ per annum
The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation And Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
What You Can Expect
Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
What We're Looking For
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
Strong fundamentals in EM, transmission lines and microwave theory
Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
Familiarity with IC package layout tools like APD or PADS
Experience with 2.5D/3D package development is highly desired.
Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
Working knowledge of circuit design tools: Spectre, ADS, HSpice
Experience with VNA and TDR measurements for package and PCB characterization
Frequency domain and time domain knowledge of high speed signaling
Experience with high-speed electronic packaging for digital and analog ICs
Power plane design, modeling and analysis using tools like PowerSI, SIwave
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Understanding, debugging and simulations of EMI/EMC problems
Track record of new product introduction from concept, through development and production is a plus.
Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
Experience with channel simulations using MATLAB or ADS or other tools is a plus.
A team player
Expected Base Pay Range (USD)
0 - 0, $ per annum
The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation And Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.